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AS1110 constant-current, 16-channel le d driver with diagnostics data sheet www.austriamicrosystems.com revision 1.00 1 - 24 1 general description the AS1110 is designed to drive up to 16 leds through a fast serial interface and features 16 output constant current drivers and an on-chip diagnostic read-back function. the high clock-frequency (up to 50mhz), adjustable out- put current, and flexible serial interface makes the device perfectly suited for high-volume transmission applications. output current is adjustable (up to 100ma/channel) using an external resistor (r ext ). the serial interface with schmitt trigger inputs includes an integrated shift register. additionally, an internal data register stores the currently displayed data. the device features integr ated diagnostics for over- temperature, open-led, a nd shorted-led conditions. integrated registers store global fault status information during load as well as th e detailed temperature/open- led/shorted-led diagnostics results. the AS1110 also features a low-current diagnostic mode to minimize display flicker during fault testing. the AS1110 is available in a 24-pin ssop and the 28- pin qfn (5x5mm) package. figure 1. main diagram and pin assignments 2 key features 16 constant-current output channels excellent output current accuracy - between channels: <3% - between devices: <6% output current per channel: 0.5 to 100ma controlled in-rush current over-temperature, open-led, shorted-led diagnostic functions low-current test mode global fault monitoring low shutdown mode current: 10a fast serial interface: 50mhz cascaded configuration extremely fast output drivers suitable for pwm 24-pin ssop and 28-pin qfn (5x5mm) package 3 applications the device is ideal for fixed- or slow-rolling displays using static or multiplexed led matrix and dimming functions, large led matrix displays, mixed led display and switch monitoring, displays in elevators, public transports (underground, trains, buses, taxis, airplanes, etc.), large displays in stadiums and public areas, price indicators in retail stores, promotional panels, bar-graph displays, industrial controller displays, white good pan- els, emergency light indicators, and traffic signs. AS1110 sdi sdo clk ld oen rext +v led outn3 outn4 outn5 outn6 outn7 outn8 outn9 outn10 gnd v dd outn0 outn1 outn2 outn11 outn12 outn13 outn14 outn15
www.austriamicrosystems.com revision 1.00 2 - 24 AS1110 data sheet contents 1 general description ........................................................................................................ ........................ 1 2 key features ............................................................................................................... ........................... 1 3 applications ............................................................................................................... ............................. 1 4 pinout ..................................................................................................................... ................................ 3 pin assignments ............................................................................................................... ...................................... 3 pin descriptions .............................................................................................................. ....................................... 3 5 absolute maximum ratings .. ................................................................................................. ................. 4 6 electrical characteristics ................................................................................................. ....................... 5 switching characteristics ..................................................................................................... .................................. 6 7 typical operating characteristics ................ .......................................................................... ................. 7 8 detailed description ....................................................................................................... ........................ 8 serial interface .............................................................................................................. ......................................... 9 timing diagrams ............................................................................................................... ..................................... 9 error-detection mode ................ .......................................................................................... ................................. 11 global error mode ............................................................................................................. ................................... 11 error detection functions ................................. .................................................................... ................................ 12 open-led detection ............................................................................................................ ......................... 12 shorted-led ................................................................................................................... .............................. 12 overtemperature ............................................................................................................... ............................ 12 detailed error reports ........................................................................................................ .................................. 13 detailed temperature warning report ................... ........................................................................ .............. 13 detailed open-led error report .. .............................................................................................. .................. 14 detailed shorted-led error report ............................................................................................. ................. 15 low-current diagnostic mode ................................................................................................... .................... 15 shutdown mode .............. .............. .............. .............. .............. ........... ........... ............ ......... ................................... 16 9 application information .................................................................................................... ..................... 17 error detection ............................................................................................................... ...................................... 17 error detection on-the-fly ......... ........................................................................................... ....................... 17 error detection with low-current diag nosis mode ............................................................................... ........ 17 cascading devices .................... ......................................................................................... .................................. 18 constant current .............................................................................................................. .................................... 19 adjusting output current ...................................................................................................... ................................ 19 package power dissipation ............. ........................................................................................ ............................. 19 delayed outputs ............................................................................................................... .................................... 19 switching-noise reduction ..................................................................................................... ............................. 19 load supply voltage ........................................................................................................... .................................. 19 10 package drawings and markings ............................................................................................. .......... 21 11 ordering information ..... ................................................................................................. ..................... 23
www.austriamicrosystems.com revision 1.00 3 - 24 AS1110 data sheet - pinout 4 pinout pin assignments figure 2. pin assignments (top view) pin descriptions table 1. pin descriptions pin number pin name description ssop qfn 1 24:27 gnd ground 228 sdi serial data input 31 clk serial data clock . the rising edge of the clk signal is used to clock data into and out of the AS1110 shift register. in error mode, the rising edge of the clk signal is used to switch error modes. 42 ld serial data load 5:20 3:10 12:19 outn0:15 output current drivers . these pins are used as led drivers or for input sense for diagnostic modes. data is transferred to the data register at the rising edge of these pins. 21 20 oen output enable . the active-low pin oen signal can always enable output drivers to sink current i ndependent of the AS1110 mode. 0 = output drivers are enabled. 1 = output drivers are disabled. 22 21 sdo serial data output . in normal mode sdo is la tched out 8.5 clock cycles after sdi is latched in. in global error detection mode this pin indicates the occurrence of a global error. 0 = global error mode returned an error. 1 = no errors. 23 22 rext external resistor connection . this pin connects through the external resistor (r ext ) to gnd, to setup the load current. 24 23 v dd positive supply voltage -11 n/c not connected 1 gnd AS1110 24-pin ssop 24 v dd 2 sdi 3 clk 4 ld 5 outn0 23 rext 22 sdo 21 oen 17 outn12 8 outn3 7 outn2 6 outn1 20 outn15 19 outn14 18 outn13 9 outn4 13 outn8 12 outn7 11 outn6 10 outn5 16 outn11 15 outn10 14 outn9 sdo outn7 outn5 10 21 outn13 17 8 clk 1 outn0 3 outn4 7 AS1110 28-pin qfn 5x5 outn2 5 outn8 12 outn10 14 outn11 15 outn15 19 oen 20 outn14 18 outn12 16 ld 2 outn1 4 outn3 6 outn9 13 n/c 11 outn6 9 gnd sdi 26 28 gnd 24 rext 22 v dd 23 gnd 25 gnd 27
www.austriamicrosystems.com revision 1.00 4 - 24 AS1110 data sheet - absolute maximum ratings 5 absolute maximum ratings stresses beyond those listed in table 2 may cause permanent damage to the device. these are stress ratings only, and functional operation of the de vice at these or any other cond itions beyond those indicated in section 6 electrical characteristics on page 5 is not implied. exposure to absolute maxi mum rating conditions for extended periods may affect device reliability. table 2. absolute maximum ratings parameter min max units comments v dd to gnd 0 7 v input voltage -0.4 v dd +0.4 v output voltage -0.4 15 v gnd pin current 2000 ma 24-pin ssop package 2800 ma 28-pin qfn (5x5mm) package thermal resistance ja 88 oc/w on pcb, 24-pin ssop package 23 oc/w on pcb, 28-pin qfn (5x5mm) package ambient temperature -40 +85 oc storage temperature -55 150 oc humidity 5 86 % non-condensing electrostatic discharge digital outputs 2000 v norm: mil 833 e method 3015 all other pins 2000 latch-up immunity -100 - (i nom x 0.5) +100 + i nom ma eia/jesd78 package body temperature +260 oc the reflow peak soldering temperature (body temperature) specified is in accordance with ipc/jedec j-std-020c ?moisture/reflow sensitivity classification for non-hermetic solid state surface mount devices?. the lead finish for pb-free leaded packages is matte tin (100% sn).
www.austriamicrosystems.com revision 1.00 5 - 24 AS1110 data sheet - electrical characteristics 6 electrical characteristics v dd = +3.0 to +5.5v, t amb = -40 to +85 oc (unless otherwise specified). table 3. electrical characteristics symbol parameter condition min typ max unit v dd supply voltage 3.0 5.5 v v ds output voltage outn0:15 0 15.0 v i out output current outn0:15 0.5 100 ma i oh sdo -1.0 i ol sdo 1.0 v ih input voltage high level clk, oen, ld, sdi 0.7 x v dd v dd + 0.3 v v il low level -0.3 0.3 x v dd i ds(off) output leakage current oen = 1, v ds = 15.0v 0.5 a v ol output voltage sdo i ol = +1.0ma 0.4 v v oh i oh = -1.0ma v dd - 0.4v i av(lc1) device-to-device average output current from outn0 to outn15 v ds = 0.5v, v dd = const., r ext = 744 24.5 26 ma i av(lc1) current skew (between channels) i out = 25.26ma, v ds 0.5v, v dd = const., r ext = 744 1 3 % i av(lc2) device-to-device average output current from outn0 to outn15 v ds = 0.6v, v dd > 3.3v, r ext = 372 49.50 51.55 ma i av(lc2) current skew (between channels) i out = 50.52ma, v ds 0.6v, v dd = const., r ext = 372 1 2 % i av(lc3) device-to-device average output current from outn0 to outn15 v ds = 0.8v, v dd = 5.0v, r ext = 186 98 104 ma i av(lc3) current skew (between channels) i out = 90ma, v ds 0.8v, v dd = const., r ext = 186 1 2 % i lc low-current diagnosis mode v ds = 0.8v, v dd = 5.0v 0.4 0.6 0.8 ma i pd power down supply current v ds = 0.8v, v dd = 5.0v, r ext = 372 , outn0:15 = on 10 20 a %/ v ds output current vs. output voltage regulation v ds within 1.0 and 3.0v 0.1 %/v %/ v dd output current vs. supply voltage regulation v dd within 3.0 and 5.0v 1 %/v r in(up) pullup resistance oen 250 500 800 k r in(down) pulldown resistance ld 250 500 800 k v thl error detection threshold voltage 0.25 0.3 0.45 v v thh error detection threshold voltage v dd = 3.0v 1.2 1.3 1.4 v v dd = 5.0v 2.0 2.2 2.4 t ov1 overtemperature threshold flag 150 oc
www.austriamicrosystems.com revision 1.00 6 - 24 AS1110 data sheet - electrical characteristics switching characteristics v dd = 3.0 to 5.5v, v ds = 0.8v, v ih = v dd , v il = gnd, r ext = 372 , v load = 4.0v, r load = 64 , c load = 10pf; guar- anteed by design. * if multiple AS1110 devices are cascaded and t r or t f is large, it may be critical to achieve the timing required for data transfer between two cascaded led drivers. i dd(off)0 supply current off r ext = open? outn0:15 = off 2.7 6 ma i dd(off)1 r ext = 744 ? outn0:15 = off 4.3 8 i dd(off)2 r ext = 372 ? outn0:15 = off 5.4 9 i dd(off)3 r ext = 186 , outn0:15 = off 9.3 13 i dd(on)1 on r ext = 744 ? outn0:15 = on 6.2 11 i dd(on)2 r ext = 372 ? outn0:15 = on 10.5 15 i dd(on)3 r ext = 186 ? outn0:15 = on 19.5 26 table 4. switching characteristics for v dd = 5v symbol parameter conditions min typ max unit t p1 propagation delay time (without staggered output delay) clk - sdo 5 10 ns t p2 ld - outn n 100 200 t p3 oen - outn n 100 200 t p4 propagation delay time 10 ns t w(clk) pulse width clk 15 ns t w(l) ld 15 t w(oe) oen (@i out < 60ma) 200 t r * clk rise time 500 ns t f * clk fall time 500 ns t or output rise time of v out (turn off) 100 200 ns t of output fall time of v out (turn on) 100 300 ns t su(d) setup time for sdi 5 ns t h(d) hold time for sdi 5 ns t su(l) setup time for ld 5 ns t h(l) hold time for ld 5 ns t testing oen time for error detection 2000 ns t stag staggered output delay 20 40 ns t su(oe) output enable setup time 20 ns t gsw(error) global error switching setup time 10 ns t su(error) global error detection setup time 10 ns t p(i/o) propagation delay global error flag 5 ns t sw(error) switching time global error flag 10 ns f clk maximum clock frequency (cascade operation) 30 50 mhz t p3,on low-current test mode propagation delay time turn on 3 5 s t p3,off turn off 0.05 0.1 s t rext2,1 external resistor reaction time change from r ext1 = 372 , i out1 = 50.52ma to r ext2 = 37.2k , i out2 < 1ma 0.5 1 s t rext2,1 external resistor reaction time change from r ext1 = 37.2k , i out1 = 0.5ma to r ext2 = 372 , i out2 > 25ma 0.5 1 s table 3. electrical characteristics (continued) symbol parameter condition min typ max unit
www.austriamicrosystems.com revision 1.00 7 - 24 AS1110 data sheet - typical operating characteristics 7 typical operating characteristics figure 3. output current vs. r ext , figure 4. relative output current error vs. v dd , v dd = 5v; v ds = 0.8v, t amb = 25c iout/iout@vdd=5v - 1, t amb = 25c figure 5. output current vs. v ds ; figure 6. output current vs. v ds ; v dd = 5v, t amb = 25c v dd = 5v, t amb = 25c -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 33.544.555.5 vdd (v) relative output current error (%) . rext = 744 ; vds = 0.5v rext = 372 ; vds = 0.6v rext = 186 ; vds = 0.8v 1 10 100 100 1000 10000 rext ( ) iout (ma) . 0 20 40 60 80 100 120 0 0.2 0.4 0.6 0.8 1 1.2 1.4 v ds (v) i out (ma) . 0 20 40 60 80 100 120 03691215 v ds (v) i out (ma) . rext = 251 rext = 372 rext = 186 rext = 744 rext = 251 rext = 372 rext = 186 rext = 744
www.austriamicrosystems.com revision 1.00 8 - 24 AS1110 data sheet - detailed description 8 detailed description the AS1110 is designed to drive up to 16 leds through a fast serial interface and 16 constant-current output drivers. furthermore, the AS1110 provides diagnostics for detecting o pen- or shorted-leds, as well as over-temperature con- ditions for led disp lay systems, especially led tr affic sign applications. the AS1110 contains an 16-bit shift register and an 16-bit data register, which convert serial input data into parallel out- put format. at AS1110 output stages, sixt een regulated current sinks are designed to provide uniform and constant cur- rent with excellent matching between ports for driving leds within a wide range of forward voltage variations. external output current is adjustable from 0.5 to 100ma using an exter nal resistor for flexibility in controlling the brightness intensity of leds. the AS1110 guarantees to endure 15v maximum at the outputs. the serial interface is capable of operating at a minimum of 30 mhz, satisfying the requirements of high-volume data transmission. using a multiplexed input/output technique, the AS1110 adds additional functionality to pins sdo, ld and oen. these pins provide highly useful functions (open- and shorted-led detect ion, over-temperature dete ction), thus reducing pin count. over-temperature detection wil l work on-the-run, whereas the open- and shorted-led detection can be used on-the-run or in low-current diagnostic mode (see page 15) . figure 7. block diagram AS1110 rext oen clk sdi ld current generators detailed error detection 16-bit data register 16-bit shift register temperature detection 16-bit open detection & error register 16-bit short detection & error register global error detection sdo indicates 16 bit path control logic +v led outn0 outn1 outn2 outn3 outn4 outn5 outn6 outn7 outn8 outn9 outn10 outn11 outn12 outn13 outn14 outn15
www.austriamicrosystems.com revision 1.00 9 - 24 AS1110 data sheet - detailed description serial interface data accesses are made serially via pins sdi and sdo. at each clk rising edge, the signal present at pin sdi is shifted into the first bit of the internal shift register and th e other bits are shifted ahead of the first bit. the msb is the first bit to be clocked in. in error-detection mode the shift register will latch-in the corresponding error data of tempera- ture-, open-, and short-error regi ster with each falling edge of ld. the 16-bit data register will latch the data of the shift regist er at each rising edge of ld. this data is then used to drive the current generator output dr ivers to switch on the corresponding leds as oen goes low. timing diagrams this section contains timing diagrams refere nced in other sections of this data sheet. figure 8. normal mode timing diagram figure 9. output delay timing diagram oen outn x ld sdo sdi clk t su(l) t h(l) t w(l) t w(clk) t p1 t h(d) 50% 50% 50% 50% 50% 50% t su(d) oen low = output enabled t p2 outn x high = output off outn x low = output on 50% 50% 50% t w(oe) 14 x t stag t p3 oen outn0 outn1 outn15 50% 50% 50% 50% t of t or t stag 90% 90% 10% 10% 14 x t stag t stag t p3 50% 50% 50% 50%
www.austriamicrosystems.co m revision 1.00 10 - 24 AS1110 data sheet - detailed description figure 10. data input timing diagram figure 11. data input example timing diagram sdi0 clk oen ld sdo0 16 clk pulses t su(oe) t w(l) t su(l) t w(oe) t h(d) t p1 data bit 15 data bit 14 data bit 13 data bit 12 data bit n data bit 2 data bit 1 data bit 0 old data bit 15 old data bit 14 old data bit 13 old data bit 12 old data bit n old data bit 2 old data bit 1 old data bit 0 don?t care don?t care t su(d) d6 d7 d5 d4 d2 d1 d0 d3 d14 d1 d13 d12 d10 d9 d8 d11 sdi oen ld outn0 outn1 outn7 outn2 outn3 outn4 outn5 outn6 1 2 3 4 5 6 7 time clk outn8 outn9 outn15 outn10 outn11 outn12 outn13 outn14 off on off on off on off on off on off on off on off on off on off on off on off on off on off on off on off on 8 9 10 11 12 13 14 15
www.austriamicrosystems.co m revision 1.00 11 - 24 AS1110 data sheet - detailed description figure 12. switching global error mode timing diagram error-detection mode acquisition of the error status occurs at the rising edge of oen. error-detection mode is started on the rising edge of ld when oen is high. the clk signal must be low when ent ering error detection mode. error detection for open- and shorted-leds can only be performed for leds that are swit ched on during test time. to switch between error-detection modes clock pulses are needed (see table 5) . note: to test all leds, a test pattern that turns on all leds must be input to the AS1110. global error mode global error mode is entered when error-detection mode is star ted. clock pulses during this period are used to select between temperature, open-led, and shorted-led tests, as well as low-current diagnostic mode and shutdown mode (see table 5) . in global error mode, an error flag (t flag, o flag, s flag ) is delivered to pin sdo if any errors are encountered. note: for a valid result sdi must be 1 for the first device. table 5. global error mode selections clock pulses output port error-detection mode global error flag/shutdown condition 0 don't care over-temperature detection t flag = sdo = 1: no over-temperature warning. t flag = sdo = 0: over-temperature warning. 1 enabled open-led detection o flag = sdo = 1: no open-led error. o flag = sdo = 0: open-led error. 2 enabled shorted-led detection s flag = sdo = 1: no shorted-led error. s flag = sdo = 0: shorted-led error. 3 don't care low-current diagnostic mode 4 don't care shutdown mode sdi = 1: wakeup sdi = 0: shutdown t testing t su(error) o flag(in) s flag(in) t flag(in) t flag o flag s flag t sw(error) sdi oen ld clk sdo don?t care don?t care t gsw(error) t p(i/o) t p4 t p(i/o) t p(i/o) t sw(error) t gsw(error) t gsw(error) don?t care acquisition of error status
www.austriamicrosystems.co m revision 1.00 12 - 24 AS1110 data sheet - detailed description if there are multiple AS1110s in a chain, the error flag will be gated through all devices. to get a valid result at the end of the chain, a logic 1 must be applied to the sdi input of t he first device of the chain. if one device produces an error this error will show up after n *t p(i/o) + t sw(error) at pin sdo of the last device in t he chain. this means it is not possi- ble to identify which device in the chain produced the error. therefore, if a global error occurs, the detailed error report can be run to identify which as 1110, or led produced the error. note: when no error has occurred, the detailed error report can be skipped, setting ld and subsequently oen low. error detection functions open-led detection the AS1110 open-led detection is based on the comparison between v ds and v thl . the open led status is aquired at the rising edge of oen and stored inte rnally. while detecting open-leds the output port must be turned on. open led detection can be started with 1 clock pulse during erro r detection mode while the output port is turned on. note: leds which are turned off at test time cannot be tested and will be shown as a logic 1 in the detailed error report. shorted-led the AS1110 shorted-led detection is based on the comparison between v ds and v thh . the shortened led status is aquired at the rising edge of oen and stored internally. while detecting shorted-leds the output port must be turned on. shorted-led detection can be started with 2 clock pulse s during error detection mode while the output port is turned on. for valid results, the voltage at outn0:outn15 must be lower then v thh under low-current diagnostic mode operat- ing conditions. this can be achieved by reducing the v led voltage or by adding additional diodes, resistors or led?s. note: leds which are turned off at test time cannot be tested and will be shown as a logic 1 in the detailed error report. overtemperature thermal protection for the AS1110 is provided by continuous ly monitoring the device?s core temperature. the overtem- perature status is aquired at the rising edge of oen and stored internally. table 6. open led detection modes output port state effective output point conditions detected open-led error status code meaning on v ds < v thl 0 open circuit on v ds > v thl 1 normal table 7. shorted led detection modes output port state effective output point conditions detected shorted-led error status code meaning on v ds > v thh 0 short circuit on v ds < v thh 1 normal table 8. overtemperature modes output port state effective output point conditions detected overtemperature status code meaning don?t care temperature > t ov1 0 overtemperature condition don?t care temperature < t ov1 1 normal
www.austriamicrosystems.co m revision 1.00 13 - 24 AS1110 data sheet - detailed description detailed error reports the detailed error report can be read out after global erro r mode has been run. at the falling edge of ld, the detailed error report of the selected test is latched into the shift register and can be clocked out with n *16 clock cycles ( n is the number of AS1110s in a chain) via pin sdo. at the same ti me new data can be written into the shift register, which is loaded on the next rising edge of pin ld. this pattern is shown at the output drivers, at the falling edge of oen. detailed temperature warning report the detailed temperature warning report can be read out imme diately after global error mode has been run. sdi must be 1 for the first device. bit0 of the 16bit data word represents the temperature flag of the chip. figure 13. detailed temperature warning report timing diagram detailed temperature warning report example consider a case where four AS1110s are cascaded in one ch ain. the detailed error report lists the temperatures for each device in the chain: ic1:[70] ic2:[85] ic3:[170] ic4:[60] in this case, ic3 is overheated and will generate a global erro r, and therefore 4*16 clock cycles are needed to write out the detailed temperature warning report, and optionally r ead in new data. the detailed temperature warning report would look like this: xxxxxxxxxxxxxxx1 xxxxxxxxxxxxxxx1 xxxxxxxxxxxxxxx0 xxxxxxxxxxxxxxx1 the 0 in the detailed temperature warning report indicates that ic3 is the device with the over-temperature condition. note: in an actual report there ar e no spaces in the output. global flag readout detailed error report readout t h(l) t p4 t p4 sdi oen ld clk sdo new data input t flag dbit15 undefined don?t care don?t care temperature error report output dbit14 dbit13 dbit12 dbitn dbit2 dbit1 dbit0 tbit0 t (su)error t p1 for detailed timing information see timing diagrams on page 9 . t gsw(error)
www.austriamicrosystems.co m revision 1.00 14 - 24 AS1110 data sheet - detailed description detailed open-led error report the detailed open-led error report can be read out immediat ely after global error mode has been run. sdi must be 1 for the first device. figure 14. detailed open-led error report timing diagram detailed open-led error report example consider a case where three AS1110s are cascaded in one chain. a 1 indicates a led is on, a 0 indicates a led is off, and an x indicates an open led. the open-led test is only app lied to leds that are turned on. this test is used with a test pattern where all leds are on at test time. ic1:[1111111111111111] ic2:[111xx11111111x11] ic3:[1111111111111111] ic2 has three open leds switched on due to input. 3*16 clock cycles are needed to write the entire error code out. the detailed error report would look like this: comparing this report with the input data indicates that ic 2 is the device with two open leds at position 4 and 5 and one open led at position 14. for such a test it is recommended to enter low-current diagnostic mode first (see low- current diagnostic mode on page 15) to reduce screen flickering. this test can be used also on-the-fly without using an all 1s test pattern (see figure 18 on page 17) . note: in an actual report there are no spaces in the output. leds turned off during test time cannot be tested and will show a logic 1 in the detailed error report. input data: 1111111111111111 1111111111111111 1111111111111111 led status: 1111111111111111 111xx11111111x11 1111111111111111 failure code: 1111111111111111 1110011111111011 1111111111111111 acquisition of error status global flag readout detailed error report readout sdi oen ld clk sdo t h(l) open error report output new data input t p4 t p1 t p4 t sw(error) t su(error) t testing dbit0 dbit1 dbit2 dbitn dbit12 dbit13 dbit14 obit0 obit1 obit2 obitn obit12 obit13 obit14 don?t care don?t care obit15 t flag o flag dbit15 for detailed timing information see timing diagrams on page 9 . t gsw(error) t gsw(error) t gsw(error)
www.austriamicrosystems.co m revision 1.00 15 - 24 AS1110 data sheet - detailed description detailed shorted-led error report the detailed shorted-led error report can be read out immediately after global error mode has been run (see global error mode on page 11) . sdi must be 1 for the first device. figure 15. detailed shorted-led error report timing diagram detailed shorted-led error report example consider a case where three AS1110s are cascaded in one chain. a 1 indicates a led is on, a 0 indicates a led is off, and an x indicates a shorted led. this test is used on-the-fly. ic1:[11111xx111111111] ic2:[1111111111111111] ic3:[x 100011111111111] ic1 has two shorted leds which are switched on, ic3 has one shorted led switched off due to input. 3*16 clock cycles are needed to write the entire error code out. the detailed error report would look like this: showing ic1 as the device with two shorted leds at position 6 and 7, and ic3 with one s horted led at position 1. the shorted led at position 1 of ic3 cannot be detected, since leds turned off at te st time are not tested and will show a logic "1" at the detailed error report. to test all leds this test should be run with an all 1s test pattern. for a test with a n all on test pattern, low-current diagnostic mode should be entered first to reduce on-screen flickering. note: in an actual report there are no spaces in the output. leds turned off during test time cannot be tested and will show a logic 1 in the detailed error report. low-current diagnostic mode to run the open- or shor ted-led test, a test pattern must be used that w ill turn on each led to be tested. this test pat- tern will cause a short flicker on the screen while the test is being performed. the low-current diagnostic mode can be initiated prior to running a detailed error r eport to reduce this on-screen flickering. note: normally, displays using such a diagnostic mode require additional cables, resistors, and other components to reduce the current. the AS1110 has this current-reduction capability built-in, thereby minimizing the number of external components required. low-current diagnostic mode can be initiated via 3 clock pul ses during error-detection mode. after the falling edge of ld, a test pattern displaying all 1s can be written to the shif t register which will be used for the next error-detection test. input data: 1111111111111111 1111111111111111 0100011111111111 led status: 11111xx111111111 1111111111111111 x111111111111111 failure code: 1111100111111111 1111111111111111 1111111111111111 global flag readout detailed error report readout sdi oen ld clk sdo t h(l) t su(error) t p1 t sw(error) t p4 t flag s flag acquisition of error status dbit14 dbit13 dbit12 dbitn dbit2 dbit1 dbit0 don?t care don?t care sbit14 sbit13 sbit12 sbitn sbit2 sbit1 sbit0 sbit15 new data input shorted-led error report output o flag t flag t p4 t testing global flag readout dbit15 for detailed timing information see timing diagrams on page 9 . t gsw(error) t gsw(error) t gsw(error)
www.austriamicrosystems.co m revision 1.00 16 - 24 AS1110 data sheet - detailed description on the next falling edge of oen, current is reduced to i lc . with the next rising edge of oen the current will immedi- ately increase to normal levels and the detailed error report can be read out entering error-detection mode. figure 16. switching into low-current diagnostic mode timing diagram shutdown mode the AS1110 features a shutdown mode which can be entered via 4 clock pulses during error-detection mode. to enable the shutdown mode a 0 must be placed at sdi after the rising edge of the 3rd clock pulse. to disable shutdown mode a 1 must be placed at sdi after the 3rd clock pulse. the shutdown/wakeup information will be latched through if multiple AS1110 devices are in a chain. at the rising edge of the 4th clock pulse the shutdown bit will be read out and the AS1110 will shutdown or wakeup. note: in shutdown mode the supply current drops down to <10a. figure 17. shutdown mode timing diagram for detailed timing information see timing diagrams on page 9 . o flag t flag s flag don?t care re-entering error detection mode (see figure 14) (see figure 15) t testing sdi oen ld clk sdo load internal all 1s test pattern (optional) t sw(error) t p1 t su(error) normal operation current t gsw(error) t gsw(error) low-current diagnosis mode t h(l) sdi oen ld clk sdo 1 = wakeup 0 = shutdown 1 = wakeup 0 = shutdown o flag t flag s flag t p4 t su(error) t su(d)
www.austriamicrosystems.co m revision 1.00 17 - 24 AS1110 data sheet - application information 9 application information error detection the AS1110 features two types of error detection. the error detection can be used on-the-fly, for active leds, without any delay, or by entering into low-current diagnosis mode. error detection on-the-fly error detection on-the-fly will output the status of active leds during operatio n. without choosing an error mode this will output the te mperature flag at every input/output cycle. triggeri ng one clock pulse for ope n or two clock pulses for short detection during error detection mode outputs the detai led open- or short-error repo rt with the next input/output cycle (see figure 18) . leds turned off at test time are not tested an d will show a logic "1" at the detailed error report. figure 18. normal operation with error detect ion during operation ? 64 cascaded AS1110s error detection with low-current diagnosis mode this unique feature of the AS1110 uses an internal all 1s test pattern for a flicke r free diagnosis of all leds. this error detection mode c an be started at the end of each input cycle (see figure 19) . figure 19. low-current diagnosis mode with inte rnal all 1s test pattern ? 64 cascaded AS1110s display sdi sdo clk oen ld current data1 data2 data3 data2 data3 data4 t/o or s error code data1 t/o or s error code data0 t/o or s error code data2 1024x 1024x 1024x clock for error mode 0x/1x/2x rising edge of oen acquisition of error status falling edge of ld; error register is copied into shift register 100ma gef gef gef = global error flag falling edge of ld; error register is copied into shift register clock for error mode 0x/1x/2x rising edge of oen acquisition of error status clock for error mode 1x/2x 3x clocks low- current mode gef 1024x 1024x data0 rising edge of oen acquisition of error status falling edge of ld; error register is copied into shift register gef o or s error code from all 1s test pattern temperature error code use internal all 1s test pattern 100ma 100ma sdi sdo clk oen ld 0.8ma gef = global error flag 1024x data1 data2 data2 data3 data1 t/o or s error code data0 gef display current low-current diagnosis mode
www.austriamicrosystems.co m revision 1.00 18 - 24 AS1110 data sheet - application information the last pattern written into the shift register will be sa ved before starting low-current diagnosis mode and can be dis- played immediately after the test has been performed. low-current diagnostic mode is started with 3 clock pulses during error detection mode. then oen should be enabled for 2s for testing. with the rising edge of oen the led test is stopped, and while ld is high the desired error mode can be selected with the corresponding clock pulses. after ld and oen go low again the previously saved pattern can be displayed at the outputs. with the next data input the detailed error code will be clocked out at pin sdo. note: see figure 20 for use of an external test pattern. figure 20. low-current diagnosis mode with external test pattern ? 64 cascaded AS1110s cascading devices to cascade multiple AS1110 devices, pin sdo must be connected to pin sdi of the next AS1110 (see figure 21) . at each rising edge of clk the lsb of the shift register will be written into the shift register sdi of the next AS1110 in the chain. note: when n *AS1110 devices are in one chain, n *16 clock pulses are needed to latch-in the input data. figure 21. cascading AS1110 devices temperature error code data2 data1 data2 data3 gef gef t/o or s error code data0 rising edge of oen acquisition of error status display sdi sdo clk oen ld external all 1s test pattern 1024x 1024x 3x clocks low-current mode clock for error mode 1x/2x falling edge of ld; error register is copied into shift register o or s error code from test pattern 1024x gef = global error flag low-current diagnosis mode 100ma 100ma current 0.8ma AS1110 # n -1 sdi sdo clk ld oen sdi clk ld oen AS1110 #1 sdi sdo clk ld oen AS1110 #2 sdi sdo clk ld oen
www.austriamicrosystems.co m revision 1.00 19 - 24 AS1110 data sheet - application information constant current in led display applications, the AS1110 provides virtually no current variations from channel-to-channel and from AS1110-to-AS1110. this is mostly due to 2 factors: while i out 10ma, the maximum current skew is less than 3% between channels and less than 6% between AS1110 devices. in the saturation region, the characterist ic curve of the output stage is flat (see figure 5 on page 7) . thus, the out- put current can be kept constant regardless of the variations of led forward voltages (v f ). adjusting output current the AS1110 scales up the reference current (i ref ) set by external resistor (r ext ) to sink a current (i out ) at each out- put port. as shown in figure 3 on page 7 the output current in the saturation region is extremely flat so that it is possi- ble to define it as target current (i out target ). i out target can be calculated by: v rext = 1.253v (eq 1) i ref = v rext /r ext (if the other end of r ext is connected to ground) (eq 2) i out target = i ref *15 = (1.253v/r ext )*15 (eq 3) where: r ext is the resistance of the external resistor connected to pin rext. v rext is the voltage on pin rext. the magnitude of current (as a function of r ext ) is around 50.52ma at 372 and 25.26ma at 744 . figure 3 on page 7 shows the relationship curve between the i out target of each channel and the corresponding external resistor (r ext ). package power dissipation the maximum allowable package power dissipation (pd) is determined as: p d(max) = (t j -t amb )/r th(j-a) (eq 4) when 16 output channels are turned on simultaneously, the actual package power dissipation is: p d(act) = (i dd *v dd ) + (i out *duty*v ds *16) (eq 5) therefore, to keep p d(act) p d(max) , the maximum allowed ou tput current as a function of duty cycle is: i out = {[(t j -t amb )/r th(j-a) ]-(i dd *v dd )}/v ds /duty/16 (eq 6) where: t j = 150oc delayed outputs the AS1110 has graduated delay circuits between output s. these delay circuits can be found between outn n and constant current block. the fixed delay time is 20 ns (typ) where outn0 has no delay, outn1 has 20ns delay, outn2 has 40ns delay ... outn15 has 300ns delay. this delay prevents large inrush currents, which reduce power supply bypass capacitor requirements when the outputs turn on (see figure 10 on page 10) switching-noise reduction led drivers are frequently used in switch-mode applications which normally exhibit switching noise due to parasitic inductance on the pcb. load supply voltage considering the package power dissipation limits (see eq 4:6), the AS1110 should be operated within the range of v ds = 0.4 to 1.0v. for example, if v led is higher than 5v, v ds may be so high that p d(act) > p d(max) where v ds = v led - v f . in this case, the lowest possible supply voltage or a voltage reducer (v drop ) should be used. the voltage reducer allows v ds = (v led -v f ) - v drop . note: resistors or zener diodes can be used as a voltage reducer as shown in figure 22 .
www.austriamicrosystems.co m revision 1.00 20 - 24 AS1110 data sheet - application information figure 22. voltage reducer using resistor (left) and zener diode (right) AS1110 v ds v f voltage supply } v led v drop AS1110 v ds v f v led v drop voltage supply {
www.austriamicrosystems.co m revision 1.00 21 - 24 AS1110 data sheet - pack age drawings and markings 10 package drawings and markings the AS1110 is available in a 28-pin qfn (5x5mm) package and a 24-pin ssop package. figure 23. 28-pin qfn (5x5mm) packagee notes: unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals. 1. dimensioning and tolerancing conform to asme y14.5m-1994 . 2. all dimensions are in millimeters; angles in degrees. 3. n is the total number of terminals. 4. the terminal #1 identifier and terminal numbering convention shall conform to jedec 95 spp-012 . details of termi- nal #1 identifier are optional but must be located within t he zone indicated. the terminal #1 identifier may be either a mold or marked feature. 5. dimension b applies to metallized terminal and is measur ed between 0.15 and 0.30mm from terminal tip. if one end of the terminal has the optional radius, the b dimens ion should not be measured in that radius area. 6. dimensions nd and ne refer to the number of terminals on each d and e side, respectively. -c- a3 a1 side view plane a ccc c 0.08 c nx seating d d/2 index area e aaa c aaa c top view 2x 2x 4 (d/2 xe/2) e/2 -b- -a- nxl e nxb d2/2 d2 e2/2 2 1 e2 bbb c a b ddd c -b- -a- nn-1 btm view 6 5 (d/2 xe/2) index area 4 see detail b see detail b datum a or b odd terminal side terminal tip e l1 5 symbol min typ max notes a 0.70 0.75 0.80 1, 2 a1 0.00 0.02 0.05 1, 2 a3 0.20 ref 1, 2 l 0.45 0.55 0.65 1, 2 l1 0.03 0.15 1, 2 aaa0.151, 2 bbb0.101, 2 ccc 0.10 1, 2 ddd0.051, 2 eee0.081, 2 ggg0.101, 2 symbol min typ max notes d bsc 5.00 1, 2 e bsc 5.00 1, 2 d2 3.00 3.15 3.25 1, 2 e2 3.00 3.15 3.25 1, 2 k0.20 1, 2 b 0.18 0.25 0.30 1, 2, 5 e0.50 n281, 2 nd 7 1, 2, 5 ne 7 1, 2, 5
www.austriamicrosystems.co m revision 1.00 22 - 24 AS1110 data sheet - pack age drawings and markings figure 24. 24-pin ssop package symbol min max a1.351.75 a1 0.10 0.25 a2 1.37 1.57 b0.200.30 c0.190.25 d8.558.74 e5.796.20 e1 3.81 3.99 e 0.635 bsc h0.220.49 l0.401.27 0o 8o
www.austriamicrosystems.co m revision 1.00 23 - 24 AS1110 data sheet - ordering information 11 ordering information the device is available as the standard products shown in table 9 . table 9. ordering information type description delivery form package AS1110-bssu constant-current, 16-channel led driver with diagnostics tubes 24-pin ssop AS1110-bsst constant-current, 16-channel led driver with diagnostics tape and reel 24-pin ssop AS1110-bqfr constant-current, 16-channel led driver with diagnostics tray 28-pin qfn (5x5mm) AS1110-bqft constant-current, 16-channel led driver with diagnostics tape and reel 28-pin qfn (5x5mm)
www.austriamicrosystems.co m revision 1.00 24 - 24 AS1110 data sheet copyrights copyright ? 1997-200 7, austriamicrosystems ag, schloss premstaett en, 8141 unterpremstae tten, austria-europe. trademarks registered ?. all rights reserved. the materi al herein may not be reprodu ced, adapted, merged, trans- lated, stored, or used witho ut the prior written consent of the copyright owner. all products and companies mentioned are trademarks or registered trademarks of their respective companies. disclaimer devices sold by austriamicrosystems ag are covered by t he warranty and patent indemni fication provisions appearing in its term of sale. austriamicrosystems ag makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from pa tent infringement. austriami- crosystems ag reserves the right to chang e specifications and prices at any ti me and without notice . therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems ag for current information. this product is intended for use in normal commercial a pplications. applications requiring extended temperature range, unusual environmental requirements, or high reliability app lications, such as military, medical life-support or life- sustaining equipment are specifically not recommended wit hout additional processing by austriamicrosystems ag for each application. for shipments of less than 100 parts the m anufacturing flow might show deviations from the standard production flow, such as test flow or test location. the information furnished here by austriamicrosystems ag is believed to be correct and accurate. however, austriamicrosystems ag shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or ar ising out of the furnishing, performance or use of the tech- nical data herein. no obligation or liability to recipient or any third party shall arise or flow out of austriamicrosystems ag rendering of technical or other services. contact information headquarters austriamicrosystems ag a-8141 schloss premstaetten, austria tel: +43 (0) 3136 500 0 fax: +43 (0) 3136 525 01 for sales offices, distributors a nd representatives, please visit: http://www.austriamicrosystems.com/contact

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